| 摘要 |
<p>PURPOSE:To make an arrangement pitch of inner leads small and to satisfactorily bond the inner leads to an IC element by a method wherein tips of a plurality of inner leads arranged at the inside of a device hole are connected and held by using an insulating tape. CONSTITUTION:A film 2 where pilot holes 3 have been formed on both sides and which is composed ot an insulating plastic is formed to be lengthwise; a device hole 4 corresponding to an IC element is stamped in its lengthwise direction. Inner leads 6 are formed of a copper foil from the inside to the outside of this hole 4; outer leads 5 are formed of the copper foil at their outside; tips of a plurality of the leads 6 arranged at the inside of the bole 4 are connected and held by an insulating tip-connection film 7. Accordingly, it is possible to restrain the tips of the leads 6 from being bent and deformed; a position of the IC element 8 with reference to an electrode pad 9 is matched well; the leads can be bonded to the element 8 satisfactorily.</p> |
