| 摘要 |
<p>PURPOSE:To prevent a semiconductor wafer from being broken from a groove by a method wherein a mask pattern of an element is arranged in such a way that etching grooves are not connected selectively on the rear of the semiconductor wafer. CONSTITUTION:The title device is constituted of the following: a semiconductor wafer 21; scribing lines 22 used when the wafer is divided into individual elements; a surface 23 of the wafer 21; cantilever beams 11 on the wafer to be used as semiconductor elements; etching grooves 11a formed in the individual beams 11. The grooves 11a formed by a groove-etching operation of the rear of the semiconductor wafer 21 are arranged in such a way that they are not connected rectlinearly; a mask is formed. Accordingly, the etching grooves 11a, on the wafer, formed by the etching operation are not connected rectlinearly; the strength of the wafer is enhanced. Thereby, the wafer is not broken from the etching grooves when the wafer is handled carelessly or scribed.</p> |
