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发明名称
MULTI-CHIP MODULE STRUCTURE
摘要
申请公布号
EP0285064(A3)
申请公布日期
1989.08.02
申请号
EP19880104979
申请日期
1988.03.28
申请人
HITACHI, LTD.
发明人
TAKENAKA, TAKAJI;NETSU, TOSITADA;SHIGI, HIDETAKA;YAMAMOTO, MASAKAZU
分类号
H01L23/498;H01L23/538;(IPC1-7):H01L23/52
主分类号
H01L23/498
代理机构
代理人
主权项
地址
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