发明名称 POLYIMIDE EMBEDDED CONDUCTOR PROCESS
摘要 <p>A polyimide embedded conductor process assures adherence of a metal conductor to a polyimide layer and allows closer spacing between conductors. The conductor is laid on a sacrificial substrate, and then the polyimide layer is laid over the conductor and substrate. The substrate is etched away to expose the conductor, and the polyimide layer may be etched away from the conductor to form attachment tabs.</p>
申请公布号 CA1252696(A) 申请公布日期 1989.04.18
申请号 CA19860502054 申请日期 1986.02.18
申请人 TEKTRONIX, INC. 发明人 LAAKSO, CARL W.;REAGAN, JOHN J.;BECKMAN, ROBERT L.
分类号 H05K3/00;H05K3/20;H05K3/40;(IPC1-7):H05K3/06 主分类号 H05K3/00
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