| 摘要 |
PURPOSE:To avoid penetration of abrasive liquid between a substrate and a wafer mounting assembly and also prevent detachment of the substrate as well as etching of the rear by using liquid insoluble in abrasive liquid as liquid attracting the substrate when a polishing treatment of the semiconductor substrate is performed. CONSTITUTION:Holding liquid 3 applied on a mounting material 22 has insolubility in water-soluble abrasive liquid solvent for polishing. A substrate 4 is pressed into the mounting material 22 through holding liquid 3 and is attracted to the mounting material 22 by surface tension of holding liquid 3. If the substrate 4 is held in this way, attachment and detachment of the substrate 4 can be easily performed in the same manner as that is attracted with water and further, when washed in and after, the process of polishing, holding liquid 3 is so insoluble in abrasive liquid that no abrasive liquid enters the rear of the substrate 4 to come up to the surface or no etching takes place in the rear of the substrate. |
