| 摘要 |
PURPOSE:To provide the titled composition outstanding in heat releasability and thermal shock resistance, for use in electronic and electric parts, etc., comprising an epoxy resin, novolak type phenolic resin, and each specified amount of silicon carbide powder and fused silica powder CONSTITUTION:The objective composition comprising (A) an epoxy resin, (B) a novolak type phenolic resin. (C) silicon carbide powder (pref. with a size <=100mu) and (D) fused silica powder (pref. with a size <=100mu). The amount of the components C plus D to be incorporated account for 25-90wt% of the whole resin composition. The equivalent ratio of the epoxy group in the resin A to the phenolic OH group in the resin B fall pref. between 0.1 and 10. The weight ratio of the component C to the component D fall. pref. between 0.2 and 5.0.
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