| 摘要 |
<p>PURPOSE:To permit to restrict bubbles between base plates upon bonding ultra-high density and multi-layer printed sheets by a method wherein a mechanism to regulate the space between hot plates, for finishing evacuation before pressurizing and heating after inserting boards to be bonded, is provided in the titled hot press. CONSTITUTION:Printed-wiring boards 26 to be bonded, which are constituted of a lower jig plate 25a accommodating a lifting spring 24 and an upper jig plate 25b, are lifted and inserted between a lower hot plate 6 provided with molding heat energy from a control device 23 for heating and cooling and an intermediate hot plate 16 as well as between the intermediate hot plate 16 and an upper hot plate 12. Hydraulic pressure, fixing a vacuum packing 7 at an intermediate position between the hot plates so as to be capable of contacting the packing 7 with the hot plates without contacting the lower hot plate 6 and the intermediate hot plate 10 with the boards to be bonded in the total lift of a cylinder 18, is supplied from a hydraulic device 27 to a main ram cylinder 2, a counter cylinder 11 and an auxiliary ram cylinder 18 while the boards between the hot plates are evacuated by an evacuating device 30 through a pipeline 29 connected to an evacuating hole 28. At the same time, a hydraulic pressure for bonding is supplied to the main ram cylinder 2 to bond the printed-wiring boards in a vacuum state under heating and pressing.</p> |
