| 摘要 |
PURPOSE:To prevent the damage on the surface of a chip when a semiconductor element chip is sealed with resin, by providing a double-layer structure, in which a molding resin layer, wherein filler is not included or the amount of inclusion of the filler is very small, and a molding resin layer including the filler are provided. CONSTITUTION:The surface part, which is directly contacted with a chip 1, is once sealed with a molding resin layer 6 made of a resin material, which does not include filler or includes a small possible amount of the filler. Then the surface part of the molding resin layer 6 is sealed with a molding resin layer 7 made of a resin material, which includes the filler 3 in a high density, again. Thus, the damage on the surface part of the semiconductor element chip can be prevented.
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