| 摘要 |
PURPOSE:To prevent the semiconductor-forming surface of a semiconductor substrate from contact with the groove aperture surface of a substrate containment section, by shaping the substrate containing section in a linear structure of unsymmetry. CONSTITUTION:The semiconductor substrate containment guide 1 has the structure that a groove aperture 3 is larger than the groove bottom 4 of the semiconductor containment guide. Besides, the distance from the groove aperture surface 8 of said guide located on the semiconductor-forming surface 6 side of a semiconductor substrate 5 to the substrate 5 is larger than the distance from the groove aperture surface 9 of said guide located on the semiconductor-forming surface back 7 side of the substrate 5 to the substrate 5. A semiconductor receiver 2 has a structure completely equal to that of said guide, and the respective groove of said guide 1 and the semiconductor substrate receiver 2 are in the same line and constructed at equal pitches. When the semiconductor substrate 5 is stored in the above-mentioned container, the semiconductor-forming surface 6 does not come into contact with the groove aperture surface 8 of said guide. |
