发明名称 CONTROLLER FOR OPERATION OF DIE BONDING DEVICE
摘要 PURPOSE:To measure the operating efficiency of a die bonding device automatically by installing a plurality of detectors detecting the state of operation of various apparatus constituting the die bonding device and arithmetically operating and processing detecting data detected by each detecting section by a controller. CONSTITUTION:When abnormality is generated in the operation of each section of a die bonder, abnormality is detected by detectors 15-18 and an ITV signal inputting section 20, and the detecting signals are memorized to a temporary memory storage 19 in order of the generation of abnormality. Memory contents in the temporary memory storage 19 are transmitted over a parallel-series converter 21 by the command of a control section 29 in a controller proper 24, converted into series signals in the converter 21, transmitted over a series- parallel converter 25, converted into parallel signals, and memorized to a memory section 26 together with time informations at that time. Contents memorized in the memory section 26 are transmitted over an arithmetic operation section 27, and arithmetically operated and processed according to a required method by the indication of the control section 29, and the result is displayed as printing or pictures in an output section 28.
申请公布号 JPS61112337(A) 申请公布日期 1986.05.30
申请号 JP19840234633 申请日期 1984.11.07
申请人 TOSHIBA CORP;TOSHIBA MICRO COMPUT ENG CORP 发明人 TSUKADA MITSUKI;TATEISHI HITOSHI
分类号 H01L21/52;H01L21/58;(IPC1-7):H01L21/58 主分类号 H01L21/52
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