发明名称 Grinding, lapping, and polishing compounds
摘要 Grinding, lapping, and polishing compounds containing an abrasive material, a thickener, and a water-soluble alkylene oxide polymer. In addition to good applications-related characteristics, said compounds have the advantage of permitting the workpieces to be cleaned with water.
申请公布号 US4544377(A) 申请公布日期 1985.10.01
申请号 US19840595486 申请日期 1984.03.30
申请人 BASF AKTIENGESELLSCHAFT 发明人 SCHWEN, ROLAND
分类号 C08J5/14;C09K3/14;(IPC1-7):C09K3/14 主分类号 C08J5/14
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