| 摘要 |
PURPOSE:To contrive to unify the mounting process of electronic parts to a printed substrate, etc., by a method wherein the margin in size in regard to the outflow of adhesive to adhere the case, etc., of a substrate is made to unnecessary, the substrate is formed in a small size by the amount thereof, and the shape of profile of the section is made to a square as to be assimilated with a chip type laminated capacitor, etc. CONSTITUTION:A pair of conductive layers (first conductor layers) 25 for loading of oscillation elements are formed to be adhered on the surface of the substrate 22, and conductor layers (second conductor layers) 27 connected to the conductor layers 25 are adhered respectively on the inside faces of cut parts 26 to penetrate the centers in the thickness direction of the substrate at the edge faces of the confronting sides on one side. Conductor layers (third conductor layers) 29 are adhered respectively on the inside faces of cut parts 28 to open to the back of the substrate and not to open to the surface of the substrate along both the sides of the respective conductor layers 27, and the conductor layers 27, 29 adhered on the edge faces on the same side of the substrate 22 are connected respectively through a pair of conductor layer (fourth conductor layers) 30 formed to be adhered on the plane of the substrate. When the substrate having the pair of the cut parts 26 and the case are joined although the adhesive flows on the surfaces of the conductor layers 27 and on the circumferential edge faces of the substrate 22, but does not flow on the conductor layers 29. |
