| 摘要 |
PURPOSE:To prevent the generation of bend on a metal frame by a method wherein grooves are provided on the surface of the metal frame exposing on a package, and plastic deformation on the rear face of the metal frame is absorbed by the groove part. CONSTITUTION:A semiconductor pellet 15 is adhered to be fixed to a metal frame 11. The back 19 of the frame 11 is exposed from a plastic mold 8 as to act as a heat dissipating plate, and the grooves 22 of a plural number are formed on the back 19. Even when the back 19 receives force according to the injected water current of glass beads, because the back 19 of the frame 11 genertes plastic deformation in the grooves 22 direction, deformation of the frame 11 as to bend the whole is not generated. Accordingly airtightness and close adhesion of the package are improved, while the generation of a crack and disconnection of lead wires in the semiconductor pellet inside of the package can be prevented. |
