| 摘要 |
<p>PURPOSE:To obtain the stem which do not have a resin film such as resin flash that degrades a mount and a wire bonding part on the tip surfaces of supporting leads to which a light emitting element is attached, by cutting and dividing resin base body, to which a lead frame having the shape wherein a pair of the supporting leads are linked as a unitary body is sealed by resin. CONSTITUTION:The tip parts of the butted supporting leads are sealed. The resin base body 14 are molded by combining a pair of the resin base body as a unitary body. The body 14 are cut along the central line shown by an alternate long and short dash line by a cutting grind stone and the like. Thus a pair of steam 11 and 11' are separated. Then sealing surfaces 14c of the resin body, which are sealed by a resin sealing body, the the tip surfaces 12c and 12d of the supporting leads, to which the light emitting element is mounted, are exposed. Therefore, the molding flash at the mount and bonding parts can be perfectly avoided regardless of the structure of a metal mold, accuracy of the metal mold, and molding conditions.</p> |
