Semi-conductor power device assembly and method of manufacture thereof.

摘要

A heat spreader (12) has a thin ceramic layer (14) plasma sprayed onto its lower surface which may be chamfered. The upper surface of the spreader (12) is then plated with a thin nickel or gold layer (13) and a semi-conductor power device (10) is soldered to the latter.

The spreader (12) is then secured via the ceramic layer (14) to a base material (15) serving as a heat sink by a layer (16) of epoxy resin loaded with silver particles. The thin ceramic layer electrically insulates the spreader (12) from the base material (15) but enables heat conduction therebetween. The application of the plasma sprayed ceramic layer (14) to the spreader (12) is easy and economical to effect.