| 摘要 |
PURPOSE:To prevent the occurrence of troubles of parts falling and solder bridges by arranging chip parts in such a way that one-side electrodes are brought nearer to pads for connection, with the other-side electrodes being brought farther from the pads for connection, and the electrodes brought nearer to the pads for connection are faced to parts of a substrate between adjacent pads. CONSTITUTION:Chip parts 3 are arranged in such a way that one-side electrodes 4 of the parts 3 are brought nearer to the row of pads 2 for connection, with the other-side electrodes 5 being brought farther from the pad 2 row, and the electrodes 4 are faced to parts 6 of a substrate between the pads 2a and 2b. Then the electrodes 4 and 5 are respectively soldered to electrodes pads 7 and 8. When a circuit substrate 1 thus prepared is dipped in a solder bath, it can happen that the heat of the solder solution is transferred to the pad 7 through the substrate 1, but the heat does not reach such a degree that can melt the solder connecting the electrode 5 to the pad 8. |
