| 摘要 |
<p>A method and device for the alternating contacting of two wafer-type component composite arrangements (12,14) from a plurality of connected similar components, particularly a semiconductor wafer with a functional component wafer, for the production of electronic modules on a wafer plane, wherein the two component composite arrangements provided with contact metallizations respectively on the opposite-lying contact surfaces (38,39) thereof are pressed against each other in order to form contact pairs with the contact metallizations thereof and the contacting of the contact metallizations occurs by backward impingement of one compound composite arrangement (12) with laser radiation, wherein the wavelength of the laser radiation is selected according to the absorption degree of the backwardly impinged upon component-composite arrangement such that transmission of the laser radiation by the backwardly impinged upon component-composite arrangement is substantially prohibited or absorption of the laser radiation occurs essentially in the contact metallizations of one or both component-composite arrangements..</p> |
