Housing preform and electronic apparatus using the same

摘要

A housing preform consisting of a plate member formed to be bendable in which are formed electronic components (22) and an interconnect (24) electrically connecting the electronic components. The plate member is formed into a shape of the housing unfolded flat. The housing can be formed by folding the plate member. Due to this, it is possible to provide an electronic apparatus comprised of a housing in which electronic components are mounted.