发明名称 Methods for fabricating microelectronic capacitor structures
摘要 A method of fabricating a capacitor includes the steps of forming a layer of a conductive material on a substrate, and forming a patterned oxidation resisting layer on the conductive layer thereby defining exposed and unexposed portions of the conductive layer. The exposed portion of the conductive layer can be selectively oxidized thereby defining an oxide etch mask covering the exposed portions of the conductive layer. Portions of the conductive layer not covered by the oxide etch mask can be selectively etched thereby defining a vertical structure of the conductive material extending from the microelectronic substrate. This vertical structure can be coated with a dielectric layer, and a second conductive layer can be formed on the dielectric layer.
申请公布号 US6025246(A) 申请公布日期 2000.02.15
申请号 US19960660906 申请日期 1996.06.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, TAE-SUNG
分类号 H01L27/04;H01L21/02;H01L21/768;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L27/04
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