MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

A method of manufacturing a printed circuit board is provided to simplify a manufacturing process of the PCB(Printed Circuit Board) by forming a convexo-concave surface on an insulation layer using a release film. An insulation layer(10) is provided. A release film is attached to the insulation layer. The release film includes a convexo-concave forming layer, on which a convexo-concave surface is formed. A convexo-concave plane(12) is formed on the insulation layer. The release film is peeled off. A circuit layer(30) is formed on the convexo-concave plane of the insulation layer. The insulation layer configures a core layer or a build-up layer.