| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize low thermal resistance and low inductance to provide a compact/high-output IGBT module. <P>SOLUTION: An element of an upper arm is bonded to a power supply circuit pattern on a ceramic substrate. A grounding pattern of the ceramic substrate penetrates ceramics, and connected to a fin-provided copper base connected to a rear surface. An element of a lower arm is bonded to the grounding pattern with the front and rear reversed to the upper arm element. Further, A surface which is not connected to the substrate of the upper and lower arm elements is connected to be an output electrode. The fin-provided copper base is covered with a resin water passage cover to be cooled with water directly. By such a structure as above, a low inductance is achieved by significant shortening of wiring, and the lower arm element is heat-released without insulation, so that the low thermal resistance can be achieved in spite of a small bonding area. <P>COPYRIGHT: (C)2009,JPO&INPIT |
