OPTICAL MODULATOR MODULE PACKAGE

摘要

A light modulator module package is provided to protect the light modulator and the driver IC from the external moisture and pressure by forming the sealing cap beneath the printed circuit board. A lower plate(310) includes a penetration hole and incomes the incident light and emits the diffracted light to a light modulator(330). The lower plate is formed of the transparent material. The light modulator is driven by a driver IC(340) according to the driving signal. A circuit wiring(325) is installed at a prepared dummy wafer(320) on the lower plate. The dummy wafer delivers the control signal which is input through a printed circuit board(360) and a bonding wire(370) from the external circuit to the driver IC. The printed circuit board outputs the predetermined signal to the external circuit of the light modulator module package. A sealing cap(350) is positioned between the lower plate and the printed circuit board.