| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion strength between a photoresist and a base. SOLUTION: A negative photoresist 3 to transfer a photomask 4 to a semiconductor disk 1 contains an insoluble material which is made soluble by exposure. The soluble material is applied on the interface between the resist and the uppermost layer of the semiconductor disk 1 to adhere with the uppermost layer of the semiconductor disk 1. By the adhesion, the adhesion strength between the negative photoresist 3 and the base is improved. A positive photoresist contains a material which is made insoluble by exposure so as to transfer the photomask to a semiconductor disk. The soluble material is applied on the interface between the resist and the uppermost layer of the semiconductor disk so as to adhere with the uppermost layer of the semiconductor disk. By the adhesion, the adhesion strength between the positive photoresist and the base is improved. |
