发明名称 BONDING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a safe and reliable heater for boding tools used, when a lead projecting from the body of an electronic component, such as the outer lead of a semiconductor package, is soldered to the electrode pad of a circuit board. SOLUTION: PTC ceramics are utilized as a heat source in the bonding heater, thus maintaining a constant temperature of the heater. Inrush current is utilized, thus improving the heat-up characteristics of the heat source, and preventing damages to peripheral components, since the temperature does not exceeds the Curie point even if a control device breaks down.
申请公布号 JP2002057452(A) 申请公布日期 2002.02.22
申请号 JP20000241747 申请日期 2000.08.09
申请人 NIPPON TUNGSTEN CO LTD;R & G:KK 发明人 KAIMOTO TAKASHI;ARIKI KAZUO;SATO AKIRA;KASAI MASAO
分类号 B23K1/00;B23K3/047;H01L21/50;H01L21/60;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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