| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element having high adhesion and resolution, by fully preventing omission of the lines of a resist pattern due to excessive development in a normal development method. <P>SOLUTION: The photosensitive element provides a photosensitive resin composition layer laminated on an adherent on a support film, and the support film comprises a soluble resin layer soluble in alkaline water solution adjacent to the photosensitive resin composition layer, and a resin film peelable from the soluble resin layer, when it is laminated on the body to be adhered. The thickness of the photosensitive resin composition layer is 1-20 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
