发明名称 LAMINATION MOLDING DEVICE AND LAMINATION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To achieve accurate molding capable of suppressing warp, deformation and deterioration, in a three-dimensional lamination molding for molding and laminating plural materials in a same layer.SOLUTION: The lamination molding device of the invention is a lamination molding device for molding a first material and a second material in a same layer, and the device comprises: a first material supply part for supplying the first material to a predetermined position in the layer; a second material supply part for supplying the second material to a predetermined position in the layer; a vibration part for vibrating the second material; and a compression part for compressing the second material.SELECTED DRAWING: Figure 1
申请公布号 JP2016168735(A) 申请公布日期 2016.09.23
申请号 JP20150049762 申请日期 2015.03.12
申请人 NEC CORP 发明人 HISHIKI MINA
分类号 B29C67/00;B33Y10/00;B33Y30/00 主分类号 B29C67/00
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