发明名称 Resin composition and molded products
摘要 <p>The present invention provides a resin composition containing the following components (1) and (2): (1) 100 parts by weight of a resin blend formed of an aromatic polycarbonate resin (A) in an amount of 40-80 wt.% and an aromatic polyester resin (B) in an amount of 60-20 wt.%; (2) 2-10 parts by weight of an epoxy-modified block polymer (G) or (H), wherein the epoxy-modified block polymer (G) is a polymer which is obtained by epoxidation of double bonds derived from the conjugated diene compound in a block copolymer (E) which comprises in the molecule a polymer block (C) predominantly comprising an aromatic vinyl compound and a polymer block (D) predominantly comprising a conjugated diene compound; and the epoxy-modified hydrogenated block polymer (H) is a polymer which is obtained by epoxidation of residual double bonds in a partially hydrogenated block polymer (F) which is formed by partial hydrogenation of double bonds derived from the conjugated diene compound in the above block copolymer (E). The present invention also provides a thin-walled molded product obtained by molding the resin composition.</p>
申请公布号 EP0945491(A2) 申请公布日期 1999.09.29
申请号 EP19990302252 申请日期 1999.03.23
申请人 DAICEL CHEMICAL INDUSTRIES, LTD. 发明人 MIYATA, HIROTAKA;HAMANO, HIROMITSU
分类号 A63F1/02;C08G59/34;C08K3/22;C08L53/02;C08L63/00;C08L67/02;C08L69/00;(IPC1-7):C08L69/00 主分类号 A63F1/02
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