| 摘要 |
The purpose of the present invention is to provide an adhesive film (10) which exhibits sufficient transparency and ensures high reliability of solder joints. The present invention is an adhesive film (10) which is for use in inter-terminal connection and which is to be interposed between an electronic component (20) having multiple first terminals (21) on the surface and a circuit component (30) having multiple second terminals (31) corresponding to the first terminals (21), the first terminals (21) being to be electrically connected to the second terminals (31), wherein: each first terminal (21) has a width of 3 to 100μm, and bears a low-melting metal composition part that covers at least a part of the surface thereof so as to satisfy the requirements 0.6<A/B<1.4 and 2μm≤B≤170μm [wherein A is the width of the first terminal (21) and B is the width of the metal composition part]; and the distance between the metal composition parts on adjacent first terminals (21) is 3 to 60μm. The adhesive film (10) comprises a resin composition containing 10 to 70wt% of a filler and has a surface roughness (Ra) of 0.03 to 1.0μm. |
