| 发明名称 |
SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING THE SoP |
| 摘要 |
A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state. |
| 申请公布号 |
US2016113115(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514793384 |
申请日期 |
2015.07.07 |
| 申请人 |
KWON HEUNG KYU;LIM KYOUNG MOOK |
发明人 |
KWON HEUNG KYU;LIM KYOUNG MOOK |
| 分类号 |
H05K1/18;G06F1/16;H05K1/02;G01R31/28;H05K5/00;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system on package (SoP) module comprising:
a printed circuit board (PCB) having a first side and an opposing second side; a first integrated circuit (IC) attached to the first side; and a second IC attached to the second side opposite, wherein the PCB includes electrical paths along which the first IC and the second IC are electrically connected. |
| 地址 |
SEONGNAM-SI KR |
