| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of securing the reliability while suppressing increase in cost of manufacture.SOLUTION: A substrate 1 has an insulation resin 2, and a metal pattern 3 provided on the insulation resin 2. Mounted components 5 are mounted on the metal pattern 3. An epoxy resin 7 encapsulates the metal pattern 3 and the mounted components 5. Slits 8 are provided on the metal pattern 3, at the periphery of the mounted components 5. At the slits 8, the insulation resin 2 exposed from the metal pattern 3 and the epoxy resin 7 are tightly adhered.SELECTED DRAWING: Figure 2 |
