发明名称 APPEARANCE INSPECTION DEVICE WITH SOLDER
摘要 PROBLEM TO BE SOLVED: To provide an appearance inspection device with solder capable of accurately inspecting a soldering state of electronic parts on a substrate.SOLUTION: An appearance inspection device with solder includes: a lighting device 4 having a lamp for emitting light to a base plate 2 mounted with electronic components 1; irradiation angle change means (s lighting drive part 73) for changing an irradiation angle of a lamp to a fillet 11; an imaging device 6 of reflection light from the fillet; an image processing part 71 for determining whether soldering is appropriate or not from the image information obtained by the imaging device; and a trigger control part 72 for controlling so as to fetch a picked up image interlocking with the irradiation angle change means. The trigger control part uses the predetermined number of irradiation angles as a set value of the timing of imaging the reflection angle, where it is confirmed that a feature quantity obtained from the image picked up in advance by a plurality of angles mutually different between the first angle and the second angle with respect to a plurality of conforming samples and a plurality of non-conforming samples causes a significant difference.SELECTED DRAWING: Figure 1
申请公布号 JP2016050864(A) 申请公布日期 2016.04.11
申请号 JP20140176702 申请日期 2014.09.01
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAGI SEIJI
分类号 G01N21/956 主分类号 G01N21/956
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