发明名称 |
Light emitting devices having light coupling layers |
摘要 |
A light emitting device comprises a first layer of an n-type semiconductor material, a second layer of a p-type semiconductor material, and an active layer between the first layer and the second layer. A light coupling layer is disposed adjacent to one of the first layer and the second layer. In some cases, the light coupling layer is formed by roughening a buffer layer of the light emitting device. The light emitting device includes an electrode in electrical communication with one of the first layer and the second layer through a portion of the light coupling layer. |
申请公布号 |
US9299881(B2) |
申请公布日期 |
2016.03.29 |
申请号 |
US201514629250 |
申请日期 |
2015.02.23 |
申请人 |
Kabishiki Kaisha Toshiba |
发明人 |
Yan Li;Lin Chao-Kun;Chuang Chih-Wei |
分类号 |
H01L21/00;H01L33/00;H01L33/22;H01L33/10;H01L33/32;H01L33/38;H01L33/40 |
主分类号 |
H01L21/00 |
代理机构 |
Cermak Nakajima McGowan LLP |
代理人 |
Cermak Nakajima McGowan LLP ;Nakajima Tomoko |
主权项 |
1. A method for forming a light emitting device, comprising:
(a) forming an aluminum-containing Group III-V semiconductor layer on a first substrate; (b) forming a u-type gallium nitride layer on the aluminum-containing Group III-V semiconductor layer; (c) forming an n-type Group III-V semiconductor layer on the u-type gallium nitride layer; (d) forming an active layer on the n-type Group III-V semiconductor layer; (e) forming a p-type Group III-V semiconductor layer on the active layer; (f) providing a second substrate on the p-type Group III-V semiconductor layer; (g) removing the first substrate to expose the aluminum-containing Group III-V semiconductor layer; (h) roughening the aluminum-containing Group III-V semiconductor layer and the u-type gallium nitride layer to form a light coupling structure including the aluminum-containing Group III-V semiconductor layer and the u-type gallium nitride layer; and (i) providing an electrode on a top surface of the roughened surface of the light coupling structure so that the electrode contacts the aluminum-containing Group III-V semiconductor layer and the u-type gallium nitride layer. |
地址 |
Tokyo JP |