| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method and a cleaning mechanism which remove by cleaning a resin burr formed by compression molding of an electronic component such as a semiconductor chip mounted on a substrate.SOLUTION: Compression molding is performed with the use of a compression mold 1 provided with an upper mold 2 and a lower mold 4. The lower mold 4 is moved down in a state where a substrate 10 which has been molded by compression molding is held in an upper mold substrate set portion 3, and mold opening is performed.A package resin burr 14A is formed on a package 13 of the molded substrate 10. A cleaning method is structured to make an upper cleaning mechanism 16 (out loader 15) enter between the opened upper and lower molds, and suck and collect the package resin burr 14A scraped by an upper brush member 19 into an upper suction hole 21 of the upper cleaning mechanism 16, as shown in Fig. 2.SELECTED DRAWING: Figure 2 |
