Phosphor-Containing Curable Silicone Composition and Curable Hotmelt File Made Therefrom

摘要

A phosphor-containing curable silicone composition giving a curable hotmelt film and the curable hotmelt film used for light-emitting semiconductor device are provided. The composition containing the phosphor gives a tack free film at room temperature by half cure and the film is easy to fabricate the desired forms. The fabricated film is easy to pick up them from the support substrate and transferred onto a light emitting semiconductor device at room temperature. The laminated film is molten followed by cured by heating to give excellent permanent adhesion to the device surface.

主权项

1. A phosphor-containing curable silicone composition comprising:
(A) an alkenyl group-functional organopolysiloxane comprising 78 to 99% by mass of (A-1) an organopolysiloxane resin represented by the following average unit formula (1):
(R1R22SiO1/2)a(R23SiO1/2)b(R22SiO2/2)c(R2SiO3/2)d(SiO4/2)e(R3O1/2)f  (1) wherein R1 is an alkenyl group having 2 to 10 carbon atoms; R2 is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, or an aryl group having 6 to 12 carbon atoms, with the proviso that at least 40 mol % of R2 are aryl groups; R3 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; “a” is a number of 0.1 to 0.4, “b” is a number of 0 to 0.3, “c” is a number of 0 to 0.3, “d” is a number of 0.4 to 0.9, “e” is a number of 0 to 0.2, “f” is a number of 0 to 0.05, with the proviso that the sum of “a” to “e” is 1; 1 to 7% by mass of (A-2) an organopolysiloxane resin represented by the following average unit formula (2):
(R53SiO1/2)g(R4R5SiO2/2)h(R52SiO2/2)i(R5SiO3/2)j(SiO4/2)k(R6O1/2)l  (2) wherein R4 is an alkenyl group having 2 to 10 carbon atoms; R5 is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, or an aryl group having 6 to 12 carbon atoms, with the proviso that at least 40 mol % of R5 are aryl groups; R6 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; “g” is a number of 0 to 0.2, “h” is a number of 0.05 to 0.3, “i” is a number of 0 to 0.3, “j” is a number of 0.4 to 0.9, “k” is a number of 0 to 0.2, “l” is a number of 0 to 0.05, with the proviso that the sum of “g” to “k” is 1; 0 to 15% by mass of (A-3) an organopolysiloxane represented by the following average formula (3):
R73SiO—(R72SiO)n—SiR73  (3) wherein R7 is an alkenyl group having 2 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, or an aryl group having 6 to 12 carbon atoms, with the proviso that at least two R7 in a molecule are alkenyl groups, at least 30 mol % of R7 are aryl groups; and “n” is an integer of 4 to 100; (B) an organohydrogenpolysiloxane having two hydrogen atoms each directly bonded to silicon atoms in a molecule, in an amount that component (B) gives 0.5 to 10 silicon atom-bonded hydrogen atoms per one alkenyl group in component (A); (C) a hydrosilylation catalyst in a sufficient amount to conduct a hydrosilylation of the composition; and (D) a phosphor in an amount of 25 to 400 parts by mass per 100 parts by mass of the sum of components (A), (B) and (C).