发明名称 |
NONCONDUCTIVE ADHESIVE COMPOSITION AND FILM AND METHODS OF MAKING |
摘要 |
<p>To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 µm or less, a film being formed by aggregation of the organic elastic fine particles, is provided.</p> |
申请公布号 |
WO2009051980(A1) |
申请公布日期 |
2009.04.23 |
申请号 |
WO2008US78936 |
申请日期 |
2008.10.06 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY;KAWATE, KOHICHIRO;ARITA, HIROKO;YASUI, HIDEAKI;SATO, YOSHIAKI |
发明人 |
KAWATE, KOHICHIRO;ARITA, HIROKO;YASUI, HIDEAKI;SATO, YOSHIAKI |
分类号 |
C09J163/00;C09J7/00;H01B5/16 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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