| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laminated electronic component suppressed in the occurrence of cracks.SOLUTION: In a laminated electronic component 1, when a ferrite element assembly 2 is laminated to be crimped during manufacture, a gap 30 is formed in a predetermined region, so that a high crimping force can be achieved. Accordingly, adhesion between ferrite layers is improved, sinterability in a central part is enhanced, and strength in the part is improved.</p> |
