| 发明名称 | Chuck exhaust openings | ||
| 摘要 | A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level. | ||
| 申请公布号 | US9214373(B2) | 申请公布日期 | 2015.12.15 |
| 申请号 | US201213569463 | 申请日期 | 2012.08.08 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Hsu Chia-Hao;Yeh Kipling;Huang Chia-Ching |
| 分类号 | H01L21/683;H01L21/67 | 主分类号 | H01L21/683 |
| 代理机构 | Haynes and Boone, LLP | 代理人 | Haynes and Boone, LLP |
| 主权项 | 1. A chuck comprising: an electrostatic plate for securing a wafer; a plurality of supports extending from the plate to the wafer when secured to the chuck; a number of gas openings positioned to provide a gas flow to a backside of the wafer; and a number of exhaust openings disposed beyond the plurality of supports in a radial direction and positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level. | ||
| 地址 | Hsin-Chu TW | ||