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发明名称
半導体基板
摘要
申请公布号
JP5810894(B2)
申请公布日期
2015.11.11
申请号
JP20110280865
申请日期
2011.12.22
申请人
发明人
分类号
C30B29/36
主分类号
C30B29/36
代理机构
代理人
主权项
地址
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