UNIT FOR PICKING UP A DIE, APPARATUS AND METHOD FOR BONDING THE SAME AND

摘要

A die pickup unit comprises: a support plate; an ejecting unit; at least one inversion pickup unit; a vision unit; and a vision driving unit. The support plate supports a wafer sawed by a plurality of dies. The ejecting unit is positioned in a lower portion of the support plate and pushes each die toward the upper portion. The inversion pickup unit is positioned in the upper portion of the support plate to pick the pushed die upward and has a rotary unit to invert the picked die. The vision unit is positioned in the upper portion of the support plate and confirms a position of the die to be picked up from the inversion pickup unit. The vision driving unit is connected to the vision unit and operates the vision unit to confirm the position of another die to be continuously picked up after the pushed die is picked when the inversion pickup unit picks the pushed die upward.