Real-time calibration for wafer processing chamber lamp modules

摘要

An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.

主权项

1. An apparatus comprising:
a wafer processing chamber; radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber; sensors disposed outside the wafer processing chamber between the wafer processing chamber and the radiant heating elements and facing the radiant heating elements the sensors being operable to monitor energy from the radiant heating elements disposed in the different zones; and a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.