| 发明名称 |
COOLING FIN AND HEAT DISSIPATION MODULE HAVING THE SAME |
| 摘要 |
A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot. |
| 申请公布号 |
US2015289415(A1) |
申请公布日期 |
2015.10.08 |
| 申请号 |
US201514675772 |
申请日期 |
2015.04.01 |
| 申请人 |
ASUSTeK COMPUTER INC. |
发明人 |
Wong Chun-Chieh;Wang Cheng-Yu;Chiou Ing-Jer |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling fin, comprising:
a fin body; a penetration portion formed on the fin body and including a slot, a first bending wall, and a second bending wall, wherein the first bending wall and the second bending wall are formed at opposite sides of the slot; and a first bending portion formed at the fin body and adjacent to one end of the slot. |
| 地址 |
Taipei City TW |
