| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology that enables improvement in the efficiency in the visual inspection of an semiconductor device. SOLUTION: The semiconductor device includes a semiconductor chip having a plurality of electrodes on its principal surface; a plurality of leads placed to the periphery of the semiconductor chip, where a part of the leads is used as an external terminal; a plurality of bonding wires for electrically connecting the plurality of electrodes of the semiconductor chip and the plurality of leads; a chip support body on which the semiconductor chip is mounted; a plurality of suspension leads connected to the chip support body; and a resin-sealing body for sealing the semiconductor chip, the plurality of leads, the chip support body, the plurality of suspension leads, and the plurality of bonding wires, and for exposing a part of the plurality of leads, and a part of the plurality of suspension leads from the rear surface thereof; the part of one of the plurality of suspension leads, that is exposed from the rear surface of the resin-sealing body, is used as an index for identifying the direction of the resin-sealing body. COPYRIGHT: (C)2006,JPO&NCIPI |
