| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin composition containing plating nuclei which can manufacture a printed wiring board in which a circuit finer than a conventional one is formed with higher reliability while reducing an environmental load. SOLUTION: An insulating resin composition containing plating nuclei is generated by distributing the plating nuclei 2 selected from a metal oxide, metal particles having surfaces coated with organic substances, a metal complex, porous bodies carrying a metal, and metal nano particles into insulating resin 1. COPYRIGHT: (C)2009,JPO&INPIT
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