| 发明名称 |
MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals. |
| 申请公布号 |
US2015271921(A1) |
申请公布日期 |
2015.09.24 |
| 申请号 |
US201414217621 |
申请日期 |
2014.03.18 |
| 申请人 |
CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY ARMAMENTS BUREAU, M.N.D. |
发明人 |
HU SHAO-CHUNG;HORNG KUO-YANG;YANG LING-YUEH;LIU WEI-CHING;CHAO PEN-SHAN;CHEN KUN-FENG;HSU LOUIS LU-CHEN |
| 分类号 |
H05K1/14;H05K3/36;H05K1/02;H05K3/32;H05K1/18;H05K1/11 |
主分类号 |
H05K1/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectronic 3D packaging structure, comprising:
a first board with a plurality of first edges and disposed with at least one first electronic device; a second board with a plurality of second edges and disposed with at least one second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form at least one joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and provides at least one connection path for transmitting signals between the first board and the second board. |
| 地址 |
Longtan Township TW |
