SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor device and a method for manufacturing the same, and more particularly, to a semiconductor device which improves a structure of an interposer that configures a fan-in POP typed package to prevent the warpage phenomenon. To this end, the semiconductor device comprises: a lower semiconductor package including a semiconductor chip and a stacking ball attached onto a substrate to be conductible, a molding compound resin for encapsulating the conductive chip and the stacking ball, and a through mold via formed on the molding compound resin to expose the stacking ball; and an interposer connected to the stacking ball of the lower semiconductor package to be conductible, and stacked thereon, and connecting the lower semiconductor package and the upper semiconductor package to be conductible, wherein a molding support is integrally molded on a lower surface of the interposer, a connecting ball of the interposer is fused on the stacking ball of the lower semiconductor package, and then the molding support and the molding compound resin of the lower semiconductor package, which have the same material and thermal expansion coefficient, are adjacently arranged to each other.