发明名称 Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon
摘要 Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance.
申请公布号 US9080247(B2) 申请公布日期 2015.07.14
申请号 US200913386805 申请日期 2009.07.31
申请人 SHINJI DEWAKI;M-TECH JAPAN CO., LTD.;YUKARI DEWAKI 发明人 Dewaki Shinji;Matsuura Teru;Dewaki Kenji
分类号 B32B15/01;C25D3/60;C25D3/56 主分类号 B32B15/01
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A substrate comprising an electroplating deposited on a surface thereof, the electroplating containing: (1) tin by a quantity of 99.9% by mass to 46% by mass based on entire metal mass; and (2) gadolinium by a quantity of 0.1% by mass to 54% by mass based on entire mass.
地址 Nagoya JP