发明名称 |
Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon |
摘要 |
Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance. |
申请公布号 |
US9080247(B2) |
申请公布日期 |
2015.07.14 |
申请号 |
US200913386805 |
申请日期 |
2009.07.31 |
申请人 |
SHINJI DEWAKI;M-TECH JAPAN CO., LTD.;YUKARI DEWAKI |
发明人 |
Dewaki Shinji;Matsuura Teru;Dewaki Kenji |
分类号 |
B32B15/01;C25D3/60;C25D3/56 |
主分类号 |
B32B15/01 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A substrate comprising an electroplating deposited on a surface thereof, the electroplating containing:
(1) tin by a quantity of 99.9% by mass to 46% by mass based on entire metal mass; and (2) gadolinium by a quantity of 0.1% by mass to 54% by mass based on entire mass. |
地址 |
Nagoya JP |