SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor device comprising a cooler in which, by improving the shape of the connecting portions of an inlet/outlet of a coolant or the like, the pressure loss in the connecting portion or the like can be reduced.;A cooler 20 of a semiconductor device 1 includes: an inlet 27 and an outlet 28 provided on side walls 22b1, 22b2 of a case 22 opposing to each other at diagonal positions; an introduction path 24 which is connected to the inlet 27 and formed in the case 22; a discharge path 25 which is connected to the outlet 28 and formed in the case 22; and a cooling flow channel 26 between the introduction path 24 and the discharge path 25. The height of the opening of the inlet 27 is larger than the height of the introduction path 24, and a connecting portion 271 between the inlet 27 and the introduction path 24 includes an inclined surface 271b which is inclined from the bottom surface of the connecting portion 271 toward the longitudinal direction of the introduction path 24.

主权项

1. A semiconductor device comprising: an insulation circuit substrate; a semiconductor element mounted on the insulation circuit substrate; and a cooler which cools the semiconductor element connected to the insulation circuit substrate, wherein
the cooler comprises: a heat dissipation substrate joined to the insulation circuit substrate; a fin provided on a surface opposite to the joining surface with the insulation circuit substrate on the heat dissipation substrate; a case which houses the fin and is connected to the heat dissipation substrate; an inlet and an outlet for a coolant which are provided on side walls of the case, the side walls being opposed to each other, and are provided at diagonal positions of the case; an introduction path which is connected to the inlet and is formed along the inner surface of a first side wall on which the inlet of the case is provided; a discharge path which is connected to the outlet and is formed along the inner surface of a second side wall on which the outlet of the case is provided; and a cooling flow channel which is formed at a position where the fin is housed between the introduction path and the discharge path, and the height of the opening of the inlet is larger than the height of the introduction path, and, at a connecting portion between the inlet and the introduction path, an inclined surface which is inclined in the longitudinal direction of the introduction path from the bottom surface of the connecting portion is provided.