| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board, whose connection part has high adhesive strength with respect to an insulation substrate and a solder and whose solder resist layer has high strength.SOLUTION: According to a manufacturing method of a printed wiring board, a first solder resist layer (3-1) is formed on a circuit substrate 1, a conductor wiring is exposed in part by reducing a film thickness of the first solder resist layer (3-1) using a film thickness reduction treatment liquid until the thickness of the first solder resist layer (3-1) becomes thinner than a thickness of the conductor wiring, and the first solder resist layer (3-1) is exposed in its entirety. Then, a second solder resist layer (3-2) is formed, a part of the second solder resist layer (3-2) outside an area to be developed is exposed, and an unexposed part of the second solder resist layer is developed and removed. Further, a third solder resist layer (3-3) is formed, a part of the third solder resist layer (3-3) outside an area to be developed is exposed, and an unexposed part of the third solder resist layer (3-3)is removed using a developing solution.</p> |
