发明名称 METHOD OF FABRICATING A SOLDER PARTICLE
摘要 <p>A method for fabricating solder particles according to an embodiment of the present invention comprises: adding a first magnetic bar into a first container which contains a mixture including first solder particles formed through a mixing process; arranging the first container inside a second container containing a second magnetic bar; operating the first magnetic bar and the second magnetic bar; and melting the first solder particles by heating the first container.</p>
申请公布号 KR20140146872(A) 申请公布日期 2014.12.29
申请号 KR20130069728 申请日期 2013.06.18
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 BAE, HYUN CHEOL;EOM, YONG SUNG;CHOI, KWANG SEONG;LEE, HAK SUN
分类号 B23K35/40;B22F1/00;B23K35/363 主分类号 B23K35/40
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