发明名称 |
METHOD OF FABRICATING A SOLDER PARTICLE |
摘要 |
<p>A method for fabricating solder particles according to an embodiment of the present invention comprises: adding a first magnetic bar into a first container which contains a mixture including first solder particles formed through a mixing process; arranging the first container inside a second container containing a second magnetic bar; operating the first magnetic bar and the second magnetic bar; and melting the first solder particles by heating the first container.</p> |
申请公布号 |
KR20140146872(A) |
申请公布日期 |
2014.12.29 |
申请号 |
KR20130069728 |
申请日期 |
2013.06.18 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
BAE, HYUN CHEOL;EOM, YONG SUNG;CHOI, KWANG SEONG;LEE, HAK SUN |
分类号 |
B23K35/40;B22F1/00;B23K35/363 |
主分类号 |
B23K35/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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