| 发明名称 |
SEMICONDUCTOR PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a semiconductor package board and a method for manufacturing the same. The semiconductor package board according to a preferred embodiment of the present invention includes an insulating layer; a first circuit layer formed on one surface of the insulating layer and including a bump pad; a post bump formed on the bump pad and formed integrally with the bump pad; and a first solder resist layer formed on the insulating layer and the first circuit layer and having a first opening part exposing the post bump and bump pad formed thereon. |
| 申请公布号 |
US2014360768(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201414296126 |
申请日期 |
2014.06.04 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG Myung Sam |
| 分类号 |
H05K1/11;H05K3/40;H05K3/46;H05K3/10 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package board comprising:
an insulating layer; a first circuit layer formed on one surface of the insulating layer and including a bump pad; a post bump formed on the bump pad and formed integrally with the bump pad; and a first solder resist layer formed on the insulating layer and the first circuit layer and having a first opening part exposing the post bump and the bump pad formed thereon. |
| 地址 |
Suwon-Si KR |
